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Other thermal materials

National Service Hotline:86-0755-00000000

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Phone:13530423477
Fax:0755-61641127
Address:Longhua New District, Shenzhen Guanlan Street Ring Road, Mao Yuan Industrial Park B1, 2nd Floor
  • Thermal conductive silicon encapsulant

Thermal conductive silicon encapsulant

Category:Other thermal materials

Introduction:

National Advisory Service Hotline:86-0755-00000000

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欧博娱乐Y series products are kind of organic thermal conductive silicon Encapsulant with both high thermal conductive and flame rating .It can be cured
by room temperature or heating and the higher the temperature, the curing faster. It extremely suit for capacitor and small electronic equipment.Its 
softness and flexibility make it able to cover uneven surface.The heat transfer from separator or whole PCB to metal shell or diffusion plate to improve 
efficiency and life of heating electronic components.

Features & benefits:
●High thermal conductivity, fast heat transfer
●Natural sticky,without pasting others
●Can be separated by hands,easy to repair
●Insulation,waterproof,anti climate aging,anti high and low
temperature

Typical applications:
● LED high power lighting and power supply
● Transformer, sensor, coil, 欧博娱乐D stomata sea
●Other electronic component’s thermal conductive encapsulant
protect

Technical properties before & after curing:

performance evaluation

欧博娱乐Y150

欧博娱乐Y200

Beforecuring

 Appearance

A  Black fluid

B Transparent liquid

A  Black fluid

B  White fluid

 Adhesion(cps)

10000

300

12000

300

Operating

performance

A component : B componentweight ratio

100:1

100:1

Specific Gravity(g/cm3)

                2.4

2.9

operable time min

120

120

Curing timemin

1440

1440

Curing time(min,80)

                 20

20

Aftercuring

Thickness (shore C)

50-60

50-60

Thermal conductivity(w/m.k)

1.5

2.0

 Flame rating

94-V0

94-V0

The above performance data is tested 1 days later after curing , the temperature is 25℃, relative humidity is 55%.

performance evaluation

欧博娱乐Y150

欧博娱乐Y200

Before curing

 Appearance

A  Black fluid

B Transparent liquid

A  Black fluid

B  White fluid

 Adhesion(cps)

10000

300

12000

300

Operating

performance

A component : B componentweight ratio

100:1

100:1

Specific Gravity(g/cm3)

                2.4

2.9

operable time min

120

120

Curing timemin

1440

1440

Curing time(min,80)

                 20

20

After curing

Thickness (shore C)

50-60

50-60

Thermal conductivity(w/m.k)

1.5

2.0

 Flame rating

94-V0

94-V0

order:Thermal conductive silicon encapsulant

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